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S1150GH

特点

● 无铅兼容及优异的耐离子迁移性能

低的Z轴热膨胀系数

不含卤素、锑、红磷等成分,废弃燃烧时不产生剧毒其他和残留有毒成分
● 适用高端HDI性能加工需求

应用领域

● 消费电子

● 智能手机,平板电脑,笔记本

● LED,游戏设备

  • 产品性能
  • 产品证书
  • 资料下载
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.24.4 DSC 160


DMA
170
Td IPC-TM-650 2.4.24.6 5% wt. loss 400
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 35
After Tg ppm/℃ 189
50-260℃ % 2.3
T260 IPC-TM-650 2.4.24.1 TMA min 60
T288 IPC-TM-650 2.4.24.1 TMA min 60
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip -- pass
Volume Resistivity IPC-TM-650 2.5.17.1 C-96/35/90 MΩ.cm 6.0 x 108
Surface Resistivity IPC-TM-650 2.5.17.1 C-96/35/90 8.0 x 107
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 148
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 45+kV NB
Dissipation Constant (Dk) RC50%
IPC-TM-650 2.5.5.9 1GHz -- 4.30
Dissipation Factor (Df) RC50% IPC-TM-650 2.5.5.9 1GHz -- 0.010
Peel Strength (1Oz HTE copper foil) IPC-TM-650 2.4.8
After thermal Stress 288℃,10s
N/mm 1.35
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 550
CW IPC-TM-650 2.4.4 A MPa 430
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.09
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

Remarks:

Remark:

1. All the typical value is based onthe 1.6mm (8*7628) specimen. The Dk and Df value is based on 50% RC.

2. All the typical value listed above isfor your reference only, please turn to Shengyi Technology Co., Ltd fordetailed information, and all rights from this data sheet are reserved by ShengyiTechnology Co., Ltd.

Explanations:C=Humidity conditioning; D=Immersion conditioning in distilled water;E=Temperature conditioning.

The figures following the letter symbolsindicate with the first digit the duration of the preconditioning in hours,with the second digit the preconditioning temperature in ℃ and with the third digit the relative humidity.

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