产品与市场
SML02G
特点
● 无铅兼容
● 高Tg无卤，Tg 195℃(DMA)
● UV阻挡/AOI兼容
● 较低的Z轴CTE
应用领域
● 通讯设备，智能电话，高性能计算机，电子游戏设备等- 产品性能
- 产品证书
- 资料下载
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.24.4 | DMA | ℃ | 195 |
| 2.4.25D | DSC | 165 | ||
| Td | 2.4.24.6 | 5% wt. loss | ℃ | 420 |
| T288 | 2.4.24.1 | TMA | min | 60 |
| T260 | 2.4.24.1 | TMA | min | 60 |
| Thermal Stress | 2.4.13.1 | 288℃, solder dip | - | PASS |
| CTE (Z-axis) | 2.4.24 | Before Tg | ppm/℃ | 40 |
| After Tg | ppm/℃ | 210 | ||
| 50-260℃ | % | 2.3 | ||
| Dissipation Constant | 2.5.5.9 | C-24/23/50, 1GHz | - | 4.8 |
| Dissipation Factor | 2.5.5.9 | C-24/23/50, 1GHz | - | 0.013 |
| Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ.cm | 1.98×107 |
| Surface Resistivity | 2.5.17.1 | C-96/35/90 | MΩ | 3.53×106 |
| Arc Resistance | 2.5.1 | D-48/50+D-0.5/23 | s | 180 |
| Dielectric Breakdown | 2.5.6 | D-48/50+D-0.5/23 | kV | ＞45 |
| Peel Strength (1oz) | 2.4.8 | 288℃/10s | N/mm | 1.4 |
| Flexural Strength (LW/CW) | 2.4.4 | A | MPa | 600/480 |
| Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.08 |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 |
| RTI | UL | LTTA | ℃ | 150 |
Remarks:
1. All the typical values are based on the 1.6mm specimen, while the Tg is for specimen≥0.50mm, and the dielectric strength is based on other thickness specimen mentioned above.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.